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Home / US Department of Commerce / 2023-NIST-CHIPS-SMME-01

CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

Open now · Cooperative Agreement · 2023-NIST-CHIPS-SMME-01

Next cut-off
01 Nov '26
in 56 days
Call budget
,
across every grant here
Grants expected
,
not published for this call
Funding rate
,
not published, read the conditions

What this call funds

The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.

For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.

What applying costs you

ItemEstimateNote
Drafting effort3–4 weekssingle submission
Time to first payment6–9 monthscut-off → evaluation → grant agreement

These are Bemzu's estimates from the call's structure (the number of stages and whether a consortium is required) not figures published by the Commission. Only the co-financing share is read from the call itself.

Also open in DOC

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